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Industry Overview

New chip fabrication processes bring exponential complexity to semiconductor design and manufacturing. The entire workflow, from functional logic verification and physical design to optical proximity correction, now relies heavily on HPC and electronic design automation (EDA) tools.
Kunpeng HPC Solution delivers a breakthrough by deeply adapting and optimizing leading China-made EDA tools. This significantly improves simulation efficiency, resulting in shorter design cycles and higher manufacturing quality. It is the reliable, advanced technical foundation for your chip R&D and production.

Application Scenarios

Chip Design
Chip design transforms system functionality into a concrete manufacturable circuit layout through stages like architecture, logic, and physical design.
EDA tools are vital for chip design. They empower engineers to design, simulate, verify, and optimize circuits efficiently, accurately, and at reduced cost/risk. HPC accelerates the compute-intensive tasks to compress the design cycle. Kunpeng currently supports various homegrown EDA tools, including both analog and digital toolchains.
Optical Proximity Correction (OPC)
OPC is a critical computational technique used to refine lithography imaging. It drives up resolution and pattern quality to meet the rigorous demands of ultra-fine chip manufacturing.
In this process, EDA software provides essential algorithms and models for simulation, optimization, and validation. HPC is the indispensable engine, rapidly processing massive datasets to accelerate the entire lithography design cycle. This synergy empowers engineers to design with greater efficiency, dramatically boosting both the precision and speed of chip manufacturing.